PCB Capabilities and Services

FULL PCB SERVICES

Design | Fabrication – Outsourced | Assembly | After Sales – Warranty Maintenance.

Pythos Technology Philippines Inc. Provides customer-specific solutions to their PCB assembly requirements. We are specialized and cater to customers that require High Mix – Low Volume PCB assembly which results in lower product costs. We offer in-house Design, Component Sourcing, Component Assembly, Visual/Mechanical Inspection, Debug/Testing and direct shipping to customers worldwide.

DESIGN

  • Schematic entry, layout/routing as per customer schematics.
  • Component library creation, editing, and maintenance.

  • LAYOUT SOFTWARE / TOOLS
  • PCAD
  • Mentor PADS
  • CAM350

CUSTOM LIBRARIES

  • Customer-provided libraries
  • In house developed libraries of common (off-the-shelf) components

DESIGN RULES / STANDARDS

  • Customer-specified design rules / standards

FABRICATION

  • PCB fabrication is done through Fab houses in Singapore, SKorea, China or US

PCB REWORK AND MODIFICATIONS

CURRENT FAB HOUSES: PYTHOS QUALIFIED SUPPLIERS

  • ​​Gorilla, U.S. (for RF boards)
  • MEI (Marcel), U.S. (for RF boards)
  • Additive Circuits, Singapore
  • King Brother, China
  • Ace Tech, South Korea

ALTERNATIVE FAB HOUSES

  • Action PCB China –  for small PCB

CUSTOMER APPROVED FAB HOUSES

  • Other fab houses are used depending on customer preference.

FABRICATION CAPABILITY

  • Finished Board Sizes (inches)
  • DUT Pitch, Minimum (mm)
  • Layer Count
  • Board Thickness (mil)
  • Minimum Inner Thin Core Thickness (mil)
  • Minimum Inner Layer Line Width / Space (mil)
  • Minimum Outer Layer Line Width / Space (mil)​
  • Minimum Pad Size (mil)
  • Maximum Aspect Ratio (Thru-Hole)
  • Minimum Laser Drill Size (mil)

ASSEMBLY

  • Surface mount / reflow​
  • Components are sourced based on an approved BOM.
  • Component mounting base on IPC-J-STD 001 STD
  • PCB assembly, inspection based on the IPC A-610 Standard
  • Packaging based on customer requirements

ASSEMBLY CAPABILITY

  • Surface mount/reflow
  • Smallest Chip Component Size
  • Smallest BGA Pitch (mm)
  • Through-hole mounting
  • 10x Optical Visual Inspection High Definition Camera Visual Inspection

COMPONENT KITTING

  • Component Sourcing is done through component sources in Asia, Europe, and U.S.
  • Direct ship to Pythos factory in the Philippines or consolidated shipment to Pythos U.S. Office, then shipped to our factory through a courier.
  • The average kitting lead time is two (2) weeks; except for long lead time items (RF filters, special-length RF cables, and connectors).

COMPONENTS ARE KITTED AS PER BOM

  • Component checked as per BOM
  • Part #, body marks, sizes
  • Actual value using Smart Tweezer

COMPONENTS MOUNTING

  • Kitted components are lined up for assembly as per schedule (FIFO)
  • Update/Progress is tracked thru Web Based PCB Assembly Tracker

BASED ON IPC J-STD 001

  • 1 Tech/board – for easy traceability
  • For Super dense boards and/or expedited boards, where 24 hrs support is necessary; 2 Techs per board

FOR HYBRID ASSEMBLY

  • A stencil is ordered as per customer board file
  • Customer board file is needed to program the chip shooter (IPC file)

PCB ASSEMBLY CAPABILITY

  • High-Mix-Low-Volume PCB assembly
  • Fabrication is done through partner PCB Fab houses in Singapore, South Korea, Taiwan or China
  • Manual mounting and soldering
  • Precise screen printing for solder paste dispense
  • Auto mount using Philips chipshooter
  • IR Reflow Oven up to 300 mm x 300 mm
  • DI Wash and Drying Oven for Clean and Bake process

CLEAN AND BAKE

  • After component mounting, assembled PCB is cleaned, air dried and then baked in oven
  • Board is soaked in IPA, washed with DI water, air dried with OFA and baked in a drying oven

VISUAL AND MECHANICAL INSPECTION (IPC 610)

  • Inspection of completeness in based on BOM and assembly drawing provided by the customer
  • Verification is done on 10X diopter and high-def, camera-based manual inspection system.

OPERATIONS CONTROL

PCB ASSEMBLY TRACKER

  • Web based real-time PCB assembly process monitoring, component consolidation and notification system.
  • Provides detailed report for PCB Assembly performance and traceability.

ARCHITECTURE

  • Client-Server application (Apache Webserver)
  • Interface – Web Based Form Based ​GU

CLASSIFICATION

  • Multi User : Yes
  • Account Leveling : Yes
  • Data Storage : ​Centralized
  • Database and Security: MySQL | ​IP Filtering | Access List
  • Security : User Login
  • Language / Script: PHP, Javascript, CSS
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