Objective:

• To establish a method to retain or to restore a functional unit in in which the unit can perform its required functions.

Capabilities:

• High value and high complexity Printed Circuit Board (PCB) re-engineering and rebuilt
• Reverse Engineering of Electronics modules regardless of completeness of schematic and documents
• In-circuit and functional debugging and repair of Electronic modules
• Component replacement for Surface Mount Technology (SMT) and   Thru hole
• Data tracking and documentation of repairs done on the module
• Post repair testing
• Before and after repair documentation
• After sales support and warranty repair